The Qualcomm Snapdragon 830 will reportedly be produced by Samsung using a 10mn process. The system-on-chip is to be the successor to the Qualcomm Snapdragon 820 series which powered a number of flagship Android smartphones in 2016.
In recent years Samsung has used both Qualcomm Snapdragon and its own Exynos SoCs for its premium smartphones. This decision has meant the same model Samsung smartphone has come with a different chipset, depending on where in the world it has been purchased.
Using both Samsung Exynos and Qualcomm Snapdragon chipsets has been important, as it has ensured Samsung’s premium hardware has been compatible with a range of US mobile networks.
European editions of the South Korean company’s flagships have been powered by Samsung Exynos SoCs, while Qualcomm Snapdragon chipsets have been used in the US. This has been to ensure compatibility with the CDMA networks that are present in the US.
Despite the latest manufacturing deal, it is highly likely that Samsung will continue to use its own SoCs in many markets for next year’s Samsung Galaxy S8.
A development that has the potential to benefit both future Qualcomm Snapdragon and Samsung Exynos chipsets is Fan-out Panel Level Package technology. The two companies are said to be working on this jointly, and it has the potential to lower manufacturing costs at the same time as reducing size and allowing for the inclusion of a greater number of ports.